302299 Lumberg Series 30 | Micromodul™ connectors, pitch 1.27 mm

Micromodul™ connector for direct mating, insulation displacement technology (IDT), with locking on printed circuit board by means of locking hooks and toes, with closed sides


Technical Data

Environmental conditions

Temperature range: -40 °C/+130 °C  *1

1) upper limit temperature (insulating body) RTI (electrical) of the UL Yellow Card

Materials

Insulating body: PA GF, V-0 according to UL94  *1

Contact spring: CuSn, pre-nickel and tin-plated – 302299
CuSn, pre-nickel-plated, gold-plated in cotact area, tin-plated in insulation displacement area – 302299 V122

1) component glow wire resistant (GWT 750 °C), testing acc. to IEC 60695-2-11, assessment acc. to IEC 60335-1 (flame < 2 s)

Mechanical data

Mating with: printed circuit board 1.6 ± 0.14 mm

Insertion force/contact: < 1.3 N

Withdrawal force/contact: > 0.3 N

Connectable conductors for IDT area

Construction: flat cable 1.27 mm LiYV

Section min.: AWG 28 (0.09 mm²)

Section max.: AWG 26 (0.14 mm²)

Insulation diameter: 1.0 mm

Note: Most products are available with different IDT contact variants. Please note the section Approved Cables below.

Electrical data (at Tamb 20 °C)

Contact resistance: ≤ 5 mΩ

Rated current: 1.2 A at Tamb 85 °C

Rated voltage: 125 V AC
40 V (VDE)
50 V AC (UL)

Poles / Product Inquiry

Designation Poles PU
(pieces)
MDQ
(pieces)
RFQ
(pieces)
Request for quote
(pieces)
302299 04 4 1300 1300
302299 04 V122 4 1300 1300
302299 06 6 1300 1300
302299 06 V122 6 1300 1300
302299 08 8 1300 1300
302299 08 V122 8 1300 1300
302299 10 10 1300 1300
302299 10 V122 10 1300 1300
302299 12 12 1300 1300
302299 12 V122 12 1300 1300
302299 14 14 1300 1300
302299 14 V122 14 1300 1300
302299 16 16 1300 1300
302299 16 V122 16 1300 1300
302299 18 18 1300 1300
302299 18 V122 18 1300 1300
302299 20 20 1300 1300
302299 20 V122 20 1300 1300
302299 22 22 1300 1300
302299 22 V122 22 1300 1300

Contact information

HRONOVSKY
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