Environmental conditions
Temperature range: -40 °C/+120 °C
Materials
Contact: CuNiSi alloy, tin-plated
Mechanical data
Mating with: tab contact 8.0 mm x 1.0 mm
applicable for reflow soldering on printed circuit board
applicable for laser welding on lead frame, e.g. Cu, tin-plated
Mating cycles: ≤ 5
Insertion force: 30 N ± 10 N *1
Withdrawal force: 10 N ± 5 N *2
1) measured with a polished steel pin, nominal dimensions 8.0 x 1.0 mm
2) measured with a polished steel pin, nominal dimensions 8.0 x 1.0 mm
Electrical data (at Tamb 20 °C)
Contact resistance: < 0.5 mΩ
Rated current: 75 A
(up to 200 A) *1
1) depending on the connection to the printed circuit board/lead frame, installation situation and heat dissipation
